Huge is the main manufacturer of unsaturated high pressure accelerated aging test chamber

Unsaturated high-pressure accelerated aging test chamber bath basin curve: bath tub curve (Bathtubcurve, failure period), also known as bathtub curve, smile curve, mainly to show the product's failure rate in different periods, mainly including early stage (early period of failure) ), normal period (random failure period), loss period (degradation failure period), which can be divided into screening test, accelerated life test (endility test) and failure rate test, etc. . "Test design", "test execution" and "test analysis" should be considered as a whole when conducting reliability tests.
Unsaturated high-pressure accelerated aging test chamber Pressure cooker test (PCT) structure: The test chamber consists of a pressure vessel consisting of a water heater capable of producing a 100% (wetting) environment, and the test article is subjected to PCT test. The different failures may be caused by a large amount of moisture condensation.
Common failure periods:
Early failure period (Infant MortalityRegion): Insufficient production, defective materials, unsuitable environment, and inadequate design.
Random life period (Normal Life, UsefulLifeRegion): external shock, misuse, fluctuations in environmental conditions, poor compression resistance.
Degradation failure period (WearoutRegion): oxidation, fatigue aging, performance degradation, corrosion.
Description: The unsaturated high-pressure accelerated aging test chamber, also known as the PCT test, is generally called the pressure cooker cooking test or the saturated steam test. The most important thing is to place the sample to be subjected to severe temperature and saturated humidity (100% RH) [saturated water vapor. Tested under pressure environment, test the high-humidity resistance of the test product, for the printed circuit board (PCB&FPC), for the material moisture absorption test, high-pressure cooking test, etc., if the test object is a semiconductor, then It is used to test the moisture resistance of the semiconductor package. The test object is tested under the harsh temperature and humidity and pressure environment. If the semiconductor package is not good, the moisture will penetrate into the package along the interface of the colloid or colloid and the lead frame. Among them, common causes of pretense: popcorn effect, open circuit caused by corrosion in the dynamic metallization area, short circuit caused by contamination between the pins of the package, etc.

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